Method for automatically identifying semiconductor wafers
AssigneeAT&T Technologies, Inc.
InventorsHibbert A. Duncan, Francis J. Ehret, Sherwin R. Kahn, Karen H. Kinney, Peter D. Parry
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AssigneeAT&T Technologies, Inc.
InventorsHibbert A. Duncan, Francis J. Ehret, Sherwin R. Kahn, Karen H. Kinney, Peter D. Parry
Estimating the term…
A technique for automatically identifying a semiconductor wafer (30) having bar code identification indicia (32) on the front surface (31) thereof. Reading of the code is achieved by rotating the wafer about an axis (34) perpendicular to its front surface (31); directing a beam of radiant energy (37) at the code (32) along a predetermined direction relative to the front surface (31); and sensing, while rotating the wafer, the reflected radiant energy (39) within a second predetermined angular direction relative to the front surface. The bar code used herein is preferably a modified or "stretched" bar code 39 formed on the front surface of the wafer, and having an aspect ratio (i.e., dimension of a space/dimension of a bar) ranging from 1 to 4 (FIG. 2).
A method for automatically identifying a semiconductor wafer comprising the steps of:
A method for automatically identifying a semiconductor wafer having coded indicia on a surface thereof, the method comprising the steps of:
A bar code identification for semiconductor wafers comprising a plurality of wide bars, wide spaces, narrow bars and narrow spaces wherein the ratio of the width of the narrow spaces to the narrow bars ranges from 2.0 to 4.0 and wherein the ratio of the width of the wide spaces to the wide bars ranges from 1.5 to 4.0 .
Dependencies are inferred from the claim text.