Apparatus and method for vapor phase solder reflow
AssigneeRCA Corporation
InventorsAnthony J. Barresi, John T. Catania, William F. Sweeney, Jr.
Life of this patent
Estimating the term…
Abstract
A solder reflow process including vaporized fluorinated organic liquid such as FC-70 is dehumidified by pressurizing the vapor chamber with dry nitrogen and blowing the dry nitrogen against the conveyor belt and article to be soldered as they pass through the inlet throat.
Claims16
In a solder reflow process including boiling a thermally stable, nonoxidizing, nonflammable fluorinated organic liquid to form a vapor at an elevated temperature, passing an article to be soldered through a chamber containing said vapor to transfer the heat of condensation from the vapor to the article to melt solder on said article, cooling the atmosphere of the chamber at the locations where said article is passed into and out of said chamber to condense the vapor to preclude its escape to the ambient atmosphere, said liquid and vapor including components which tend to combine with moisture to form undesirable acid, said cooling tending to condense water vapor in said chamber to thereby form said acid, the improvement comprising injecting a dry inert gas into said chamber to remove substantially all said water vapor from said chamber to preclude said acid forming and threafter maintaining the pressure of said chamber with said dry inert gas above the pressure of ambient atmosphere at a sufficient differential to preclude moisture from entering said chamber while precluding substantial loss of said vapor in the presence of said pressure differential.
A process for melting solder comprising:
- boiling a nonoxidizing, thermally stable, nonflammable fluorinated organic liquid at a temperature above the melting point of said solder;
- substantially confining the vapors of said boiled liquid within a given chamber;
- removing substantially all water including liquid water and water vapor from said chamber while the chamber is in communication with the ambient atmosphere by pressurizing the chamber with a dry inert gas at a pressure sufficiently above that of the ambient atmosphere to preclude moisture from entering said chamber and maintaining the pressure differential between said chamber and the ambient atmosphere sufficiently low to minimize substantial loss of said vapors to said ambient atmosphere;
- passing an article including said solder to be melted through said given chamber;
- and
- removing moisture from the ambient atmosphere surrounding said article prior to said passing to preclude admission of moisture during the processing of the article.
A solder reflow apparatus comprising:
- a thermally stable nonoxidizing, nonflammable fluorinated organic liquid having a boiling point above the melting point of solder,
- means for boiling the thermally stable, nonoxidizing, nonflammable fluorinated organic liquid at a temperature above the melting point of said solder;
- means for confining the vapors of said boiled liquid to a given chamber;
- means for removing substantially all water from said given chamber;
- means for passing an article including said solder to be melted through said given chamber;
- and
- means for removing moisture from the ambient atmosphere surrounding said article immediately prior to said passing.
A solder reflow apparatus comprising:
- an enclosed chamber having an inlet port and an outlet port sufficiently large to receive an article to be processed by said apparatus, said ports being continuously open to the ambient atmosphere;
- a thermally stable, nonflammable fluorinated organic liquid in said chamber having a boiling point above the melting point of solder;
- heating means in said chamber for boiling said liquid;
- cooling means inside said chamber surrounding each said port for condensing the vapors produced by said boiling liquid to preclude escape of said vapors through said ports to said ambient atmosphere;
- conveyor means passing through said ports and chamber for conveying an article to be processed by the vapor produced by said boiling liquid;
- and
- means for continuously injecting a dry inert gas into said chamber for producing a pressure in said chamber sufficiently greater than that of said ambient atmosphere to remove substantially all moisture from said chamber prior to and during said processing and sufficiently low to preclude escape of significant amounts of the boiled liquid vapors to the ambient atmosphere during said conveying.
Dependencies are inferred from the claim text.