US 4,579,022 AGranted

Making process of a die for stamping out patterns

AssigneeThe Fujikura Cable Works, Ltd.

InventorsYasuo Kasai, Koichi Yamada, Teruo Sakuma, Masahiro Koguchi

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Abstract

The invention provides a novel method for manufacturing a knife-edge die for stamping out a metal foil on an insulating base plate such as in the preparation of an electronic circuit board by a technique of photoetching. The method comprises a line pattern of a photoresist film on the die face corresponding to the contour of the desired pattern, subjecting the die face to a first etching to effect substantial side etching behind the photoresist film to leave an edge, removing the photoresist film and subjecting the die face to a second etching to sharpen the edge into a knife edge. The invention further proposes several improvements in the knife-edge die manufactured in the same principle of the method as above such as the adjustment of the depth of the inside recess surrounded by the knife edge with a filling material and knife-edge dies suitable for continuous stamping out provided with one or more of flat-headed presser dies for the preliminary bonding of the metal foil to the base plate prior to stamping out with the knife edge and one or more limiter dies provided on one or both sides of the knife edge in order to prevent unduly deep incision of the knife edge to the base plate.

Claims1

Dependent claims

A method for manufacturing a knife-edge die provided with at least one flat-headed presser die which comprises the steps of

(a) putting a transparency bearing a line pattern having a uniform line width, the center line of said line pattern relative to the width thereof being along the contour line of the pattern desired to be stamped out and a full pattern in the form of the pattern desired to be stamped out, said line pattern and said full pattern being disposed in parallel with each other, on the surface of a die block coated with a film of a photoresist material in direct contact therewith,
(b) irradiating the photoresist film with light through the transparency to have the photoresist material photocured under the line pattern and the full pattern on the transparency,
(c) developing the photoresist material to leave the photocured films pattern-wise corresponding to the line pattern and the full pattern on the transparency,
(d) subjecting the surface of the die block to a first etching to such an extent that substantial side etching takes place behind the photoresist film corresponding to the line pattern,
(e) removing the photoresist films from the surface of the die block so as to expose the edge and a plateau-like flat surface behind the photoresist film corresponding to the full pattern,
(f) grinding the plateau-like flat surface to reduce the height thereof, and
(g) subjecting the surface of the die block with the thus exposed edge and the ground plateau-like flat surface to a second etching to such an extent that the edge is sharpened to form a knife edge and the plateau-like flat surface is provided with a rounded shoulder to form a presser die.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 06/539,799Filed 7 Oct 1983 · continuation
Priority: JP 54-16662520 Dec 1979
Granted: 1 Apr 1986
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

B23P 15/406
Shearing tools: rotary or plane die cutters
C23F 1/04
Local etching: chemical milling
H05K 3/041
The conductive material being removed mechanically, e.g. by punching: by using a die for cutting the conductive material
H10W 70/047
Of leadframes: attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]