Method and apparatus for handling semiconductor wafers

A wafer pickup device for handling semiconductor wafers comprising:

• a substantially planar pickup surface having a substantially centrally located surface formed therein;
• a plurality of tubular bodies extending away from said pickup surface and located proximate to and within the outer boundaries of said pickup surface to overlie the periphery of a wafer to be picked up;
• first means coupled to said orifice and to said tubular bodies for selectively applying pressurized fluid therethrough for lifting the semiconductor wafer to be picked up toward and in spaced relationship to the pickup surface;
• and
• second means coupled to said tubular bodies for selectively applying vacuum therethrough thereby holding the semiconductor wafer at its periphery against the tubular bodies once the flow of pressurized fluid is interrupted.

A method for handling a semiconductor wafer by means of a pickup device comprising the steps of:

• lifting and supporting, by means of a flow of pressurized fluid, a semiconductor wafer utilizing the Bernoulli effect;
• gently contacting a plurality of predetermined portions of the wafer by applying vacuum to said predetermined portions;
• and
• interrupting the flow of the Bernouli effect pressurized fluid thereby holding the wafer only by means of the vacuum.

A method for handling a semiconductor wafer by means of a pickup device comprising the sequential steps of:

• positioning a planar pickup surface of the pickup device proximate to a major surface of the wafer;
• supplying a first flow of pressurized fluid through a centrally located orifice of the pickup surface toward said major surfaces for lifting the wafer utilizing the Bernoulli effect;
• supplying a plurality of second flows of pressurized fluid directed toward the major surface of the wafer through a plurality of tubular bodies extending away from the pickup surface towards the wafer;
• interrupting the second flows of pressurized fluid and applying vacuum to the tubular bodies thereby gently contacting peripheral portions of the major surface of the wafer;
• and
• interrupting the first flow of pressurized fluid thereby holding the wafer against the tubular bodies only by means of the vacuum applied thereto.