Polyether compounds, epoxy resins, epoxy resin compositions, and processes for production thereof
AssigneeDaicel Chemical Industries, Ltd.
InventorsTakaaki Murai, Shoji Watanabe, Kimio Inoue, Toyokazu Yagii
Life of this patent
Estimating the term…
Loading patent…
AssigneeDaicel Chemical Industries, Ltd.
InventorsTakaaki Murai, Shoji Watanabe, Kimio Inoue, Toyokazu Yagii
Estimating the term…
A polyether compound having ether groups and vinyl double bonds represented by formula (I) ##STR1## wherein R.sub.1 represents a residue of an organic compound having l active hydrogen atoms, n.sub.1 through n.sub.l each represents 0 or an integer of from 1 to 100, the sum of the integers represented by n.sub.1 through n.sub.l is from 1 to 100, and l represents an integer of from 1 to 100, and A represents ##STR2## and a process for production thereof; an epoxy resin represented by formula (II) ##STR3## wherein R.sub.1 and n.sub.1 through n.sub.l are defined above, and B is an oxycyclohexane unit having a substituent and is represented by formula (III) ##STR4## wherein X represents a ##STR5## --CH.dbd.CH.sub.2, or ##STR6## groups, wherein R.sub.2 represents an alkyl group, an alkylcarbonyl group, or an arylcarbonyl group, provided that the epoxy resin represented by formula (II) contains at least one ##STR7## group, and a process for production thereof; and an epoxy resin comprising an epoxy resin as in formula (II), are disclosed.
A polyether compound having ether groups and vinyl double bonds represented by formula (I) ##STR38## wherein R.sub.1 represents a residue of an organic compound having l active hydrogen atoms, n.sub.1 through n.sub.l each represents 0 or an integer of from 1 to 100, the sum of the integers represented by n.sub.1 through n.sub.l is from 1 to 100, and
A process for producing a polyether compound having ether groups and vinyl double bonds represented by formula (I) ##STR40## wherein R.sub.1 represents a residue of an organic compound having l active hydrogen atoms, n.sub.1 through n.sub.l each represents 0 or an integer of from 1 to 100, the sum of the integers represented by n.sub.1 through n.sub.l is from 1 to 100, and
An epoxy resin represented by formula (II) ##STR42## wherein R.sub.1 represents a residue of an organic compound having l active hydrogen atoms, n.sub.1 through n.sub.l each represents 0 or an integer of from 1 to 100, the sum of the integers represented by n.sub.1 through n.sub.l is from 1 to 100, and
A process for producing an epoxy resin represented by formula (II) ##STR47## wherein R.sub.1 represents a residue of an organic compound having l active hydrogen atoms, n.sub.1 through n.sub.l each represents 0 or an integer of from 1 to 100, the sum of the integers represented by n.sub.1 through n.sub.l is from 1 to 100, and
An epoxy resin composition comprising a curing agent and an epoxy resin represented by formula (II) ##STR54## wherein R.sub.1 represents a residue of an organic compound having l active hydrogen atoms, n.sub.1 through n.sub.l each represents 0 or an integer of from 1 to 100, the sum of the integers represented by n.sub.1 through n.sub.l is from 1 to 100, and l represents an integer of from 1 to 100, and B is an oxycyclohexane unit having a substituent and is represented by formula (III) ##STR55## wherein X represents a ##STR56## --CH.dbd.CH.sub.2, or ##STR57## groups, wherein R.sub.2 represents an alkyl group, an alkylcarbonyl group, or an arylcarbonyl group, provided that the epoxy resin represented by formula (II) contains at least one ##STR58## group.
Dependencies are inferred from the claim text.