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US 4,563,385 AGranted
Hybrid glass cloth for printed circuit boards
AssigneeInternational Business Machines Corporation
InventorsAnilkumar C. Bhatt, Donald E. Doran, James W. Knight
Life of this patent
Estimating the term…
Abstract
Woven glass fiber cloth for printed circuit substrates in which the warp is of plied yarn and the fill is of unplied or twisted yarn to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.
Claims6
A substrate material comprising:
- a glass woven fabric for printed circuit substrates, wherein the warp yarns are plied yarns and the fill yarns are unplied yarns.
A substrate material comprising:
- multiple layers of glass woven fabric for printed circuit substrates impregnated with a polymeric resin wherein the warp yarns are plied yarns and the fill yarns are unplied yarns in each of said layers.
Dependencies are inferred from the claim text.