Apparatus for automatically exchanging die for injection molding

An automatic die exchanging apparatus for automatically exchanging a split die on an injection molding machine having a stationary platen and a movable platen arranged to move horizontally with respect to said stationary platen, said split die having a locking mechanism adapted to automatically lock the preset die half parts, said injection molding machine having a die mounting portion between said stationary platen and said movable platen and accessible by the locked split die from a lateral side of said injection molding machine, said automatic die exchanging apparatus comprising:

• a die exchanging base having at least two transfer passages adapted to carry a locked die, said die exchanging base being movable to alternatingly bring said transfer passages into alignment with said die mounting portion at said lateral side of said molding machine;
• a transfer means for transferring said locked die from the aligned transfer passage to said die mounting portion and vice versa;
• a locating means for locating said die transferred to said die mounting portion at a predetermined postion;
• a clamping means for fixing the die half parts of the located die to said stationary platen and said movable platen of said molding machine;
• and means provided on one of said stationary and movable platens for releasing said locking mechanism to unlock said die half parts, said means being effective only when said die half parts are located to be fixed to respective platens.