Pinless connector interposer and method for making the same

A pinless connector interposer for establishing a plurality of surface connections between a set of closely spaced contact pads on the substrate of a semiconductor package and a corresponding set of contacts on a supporting rigid or flexible printed circuit board or card, comprising;

• a base member of elastomeric dielectric material,
• sets of deformable protrusions on both sides of said base member, the positioning of a first set of protrusions on a first side of said base member arranged in columns and rows and corresponding to one of said sets of contact pads on said substrate of said semiconductor package, and the positioning of a second set of protrusions on a second opposite side of said base member arranged in columns and rows and corresponding to one of said sets of contact pads on said supporting printed circuit board or card,
• a flexible overlay secured to each of said first and second sides of said base member,
• a plurality of electrically conductive elements on each of said flexible overlays with end portions of each of said conductive tab elements located over one of said deformable protrusions, and the opposite end portion of each of said conductive tab elements terminating in spaced relation to the associated deformable protrusions,
• a plurality of aligned openings through said base member, and each of said flexible overlays,
• conductive means extending through said aligned openings in said base member and overlays for electrically connecting each opposite end of an electrically conductive tab element of an overlay on said first side of said base member to a corresponding electrically conductive tab element of the overlay on said second opposite side of said base member.