Mould for encapsulating parts of elements into a plastic material
AssigneeArbo Gereedschapsmakerij B.V.
InventorEverardus H. Boschman
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AssigneeArbo Gereedschapsmakerij B.V.
InventorEverardus H. Boschman
Estimating the term…
The invention relates to a mould for encapsulating parts of elements into a plastic material to manufacture electric components. The mould comprises a number of steel blocks or rods with accurately finished surfaces for clamping them completely tight together in a holder, whereby recesses in said blocks or rods are forming the mould cavity or mould cavities and the sprues. A layer of high hardness, such as a nitride layer, is deposited by means of vapor deposition in vacuum at a high temperature onto at least those surfaces of said blocks or rods determining the mould cavity or mould cavities and the sprues. Furthermore the blocks or rods are concerning their dimensions and/or flexibility and/or structure and/or finishing of the surfaces turned away from the mould cavity embodied such that deformations in the position in which said blocks or rods are clamped into said holder, caused by the depositioning of said layer, are eliminated.
A mould assembly for encapsulating a plurality of electronic components in an encapsulation material, which mould assembly comprises a holder and a plurality of elements made from steel and having accurately finished surfaces such that said plurality of elements fit together within the holder and can be clamped tightly in the holder;
Dependencies are inferred from the claim text.