Semiconductor laser

A semiconductor laser comprising:

• a semiconductor laser chip,
• a sub-mount on which said semiconductor laser chip is bonded,
• a main-mount on which said sub-mount is bonded,
• wherein the improvement is that
• said sub-mount has first, second and third generally planar faces arranged at angles to each other,
• said main-mount has first, second and third generally planar faces arranged at angles to each other,
• said sub-mount is determined of position in a first direction by touching said first face of said sub-mount to said first face of said main-mount, is determined of position in a second direction by touching said second face of said sub-mount to said second face of said main-mount, and is determined of position in a third direction by touching said third face of said main-mount.

A semiconductor laser comprising:

• a semiconductor laser chip;
• a sub-mount having an upper surface on which said semiconductor laser chip is bonded by means of a solder layer,
• a main mount on which said sub-mount is bonded by means of another solder layer,
• wherein the improvement is that
• said main mount is provided with a recess as engaging means to receive said sub-mount therein, said recess comprising side walls, an abutting wall and a bottom surface,
• said sub-mount is provided with side walls, an abutting rear end face and an under surface opposite to said sub-mount upper surface, and
• said sub-mount is bonded on said main mount in a manner so that said side walls, said abutting rear end face and said under surface of said sub-mount engage said side walls, said abutting wall and said bottom surface of said recess, respectively.