Thin assembly for wiring substrate

A thin device for attaching and electrically connecting an electrical component to an external circuit, comprising:

• a substrate;
• an aperture within said substrate for accommodating said electrical component therein;
• a first insulating layer of organic material formed over said substrate, said first insulating layer having an opening therein in a position corresponding to said aperture in said substrate, said first insulating layer extending within an area defined by said aperture;
• first wiring means comprising a pattern of electrical circuit paths deposited on said first insulating layer;
• means for connecting said first wiring means to said electrical component;
• a second insulating layer of organic material formed over said first insulating layer and said first wiring means;
• second wiring means comprising a pattern of electrical circuit paths deposited on said second insulating layer;
• said second insulating layer comprising holes therein at positions corresponding to circuit paths of said first wiring means and said second wiring means comprising portions thereof extending through said holes into electrical contact with said first wiring means;
• a third insulating layer of organic material formed over said second insulating layer and said second wiring means;
• said third insulating layer comprising a plurality of holes therein at positions corresponding to circuit paths of said second wiring means, and a plurality of solder terminals in electrical contact with said second wiring means and extending through said holes in said third insulating layer for connecting said device to an external circuit, the distance between said terminals being substantially 350 microns.