Latent curing agents for epoxy resins
AssigneeAjinomoto Co., Inc.
InventorsKiyomiki Hirai, Koji Takeuchi, Masahiro Abe, Nobuo Ito
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Abstract
A latent curing agent for epoxy resin, characterized in that the latent curing agent is the hydrazides of the formula (I) or (II). ##STR1## The present curing agent is useful in formulating storable, one-package, heat-curable epoxy resin-based compositions.
Claims9
A compound having the formula (I) or (II):
- ##STR14##
A curing agent suitable for use with epoxy resin compositions comprising a compound having the formula (I) or (II):
- ##STR15##
A curable epoxy resin composition comprising (a) an epoxy resin having an average of more than one epoxy group per molecule and (b), as curing agent, a compound having formula (I) or (II):
- ##STR16##
A cured resin obtained by contacting an epoxy resin having an average of more than 1 epoxy group per molecule with as curing agent a compound having the formula (I) or (II):
- ##STR17## wherein (I) is at least one ortho-, meta- or para-isomer, the amount of said compound being enough to provide 0.5-1.5 times active hydrogen equivalent weight based on epoxy equivalent weight.
Dependencies are inferred from the claim text.