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AssigneeHitachi Chemical Company, Ltd.
InventorsToshiaki Ishimaru, Katsushige Tsukada, Nobuyuki Hayashi
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A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
A photosensitive resin composition for forming a solder mask comprising
A photosensitive element for forming a solder mask comprising (I) a layer of a photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or urethane dimethacrylate compound that has a molecular weight of 600 or less and that is obtained by reacting, (i) trimethylhexamethylene diisocyanate, and (ii) an acrylic or methacrylic monoester of a dihydric alcohol which has 1 to 8 carbon atoms, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light in an amount of 0.5 to 10% by weight based on the total weight of the urethane diacrylate or urethane dimethacrylate compound (a) and the linear polymeric compound (b), and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule represented by the formula:
A process for forming a solder mask by employing a photosensitive resin composition in the construction of said solder mask wherein the photosensitive resin conposition is applied to a support film as a photosensitive layer, said photosensitive resin composition comprising
Dependencies are inferred from the claim text.