Process for the manufacture of substrates to interconnect electronic components
AssigneeKollmorgen Technologies Corporation
InventorCharles L. Lassen
Life of this patent
Estimating the term…
Abstract
A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
Claims14
A process for making circuits, the steps comprising:
- (a) bonding a substrate to a support base;
- (b) coating the exposed surface of the substrate with an energy activatable adhesive;
- (c) applying and affixing to said coated surface in a pre-programmed circuit pattern to a base, a preinsulated conductor;
- (d) applying to said coated surface and said conductor affixed thereto a coating for the purpose of maintaining the position of the filament and for providing a surface suitable for mounting surface-mounted components;
- (e) without disturbing said affixed conductor leveling said coating over said surface and said conductor to form a substantially smooth, flat, planar surface;
- (f) curing and hardening said coating;
- (g) affixing the substrate with said cured and hardened coating and said insulated conductor therein on a table;
- (h) aligning said table and said substrate affixed thereto with a high energy beam source so as to align a predetermined point on the conductor affixed to said substrate with said high energy beam source;
- and
- (i) with said high energy beam source and said predetermined point so aligned, energizing said high energy beam source and with the beam of said beam source volatilizing the coating on said substrate at the area in alignment with said beam and exposing said aligned circuit conductor while maintaining the integrity of said conductor.
Dependencies are inferred from the claim text.