System for repairing electrical short circuits between parallel printed circuits

Apparatus for cleaning a plurality of thru holes on a substantially planar electrical board having two major surfaces comprising:

• (a) first gas and liquid transmission means operatively connected to the board to introduce gas and liquid into said plurality of thru holes, said first means being adapted to surround a predetermined number of thru holes and seal the periphery thereof on one of said major surfaces of the board;
• (b) second gas and liquid transmission means operatively connected to said board to remove gas and liquid from said predetermined number of thru holes, said second means being adapted to surround said thru holes and seal the periphery thereof on the other of said major surfaces of the board;
• and
• (c) means for directly forcing gas and liquid to move through said predetermined number of thru holes simultaneously from said first gas and liquid transmission means to said second gas and liquid transmission means.

A method for eliminating short circuits on electrical circuitry interconnected by a hole being plated with a layer of electrically conductive material on an electrical board, the steps comprising:

• (a) introducing an etchant into the hole to remove the layer of metal therefrom;
• (b) vacuum removing said etchant from said hole;
• (c) introducing a solvent into said hole to rinse residual etchant therefrom;
• (d) vacuum removing said solvent from said hole;
• (e) drying said hole;
• and
• (f) introducing a non-conducting material into the hole to seal exposed internal conductive material.

A method for eliminating short circuits on electrical circuitry interconnected by a hole being plated with a layer each of two electrically conductive materials on an electrical board, the steps comprising:

• (a) introducing a first etchant into the hole to remove the first layer of conductive material therefrom;
• (b) introducing a first solvent into said hole to rinse residual first etchant therefrom;
• (c) introducing a second etchant into the hole to remove a portion of the second layer of conductive material therefrom;
• (d) introducing a second solvent into said hole to rinse residual second etchant therefrom;
• (e) drying said hole;
• and
• (f) introducing a non-conducting material into the hole to seal exposed internal conductive material.

A method for disconnecting vertical conductors between horizontal conducting planes in an electrical interconnection structure comprising:

• (a) bringing a first material into contact with said vertical conductors to effect etching thereof;
• (b) vacuum removing said first material;
• (c) bringing a second material into contact with said vertical conductors to rinse residual first material therefrom;
• (d) vacuum removing said said second material;
• (e) drying the immediate area;
• and
• (f) bringing a non-conducting material into contact to seal exposed internal conductive material.