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US 4,544,377 AGranted
Grinding, lapping, and polishing compounds
AssigneeBASF SE
InventorRoland Schwen
Life of this patent
Estimating the term…
Abstract
Grinding, lapping, and polishing compounds containing an abrasive material, a thickener, and a water-soluble alkylene oxide polymer. In addition to good applications-related characteristics, said compounds have the advantage of permitting the workpieces to be cleaned with water.
Claims13
A grinding, lapping, and polishing compound comprising
- (a) from about 10% by weight to about 70% by weight finely dispersed abrasive material,
- (b) from about 5% by weight to about 15% by weight thickening agent, and,
- (c) from about 15% by weight to about 85% by weight polymeric glycol of ethylene oxide, propylene oxide, and/or butylene oxide or its monoethers with a low-molecular-weight alcohol having a molecular weight of about 55 to 25,000 as the compound base, all percentages based on the compound weight.
Dependencies are inferred from the claim text.