Substrate having dummy conductors to prevent solder build-up

In a substrate having a conductor path of solderable material arranged thereon and having a solder layer applied to the conductor path by contact as the conductor path moves along molten solder material, the improvement comprising

• on the substrate, close alongside of the conductor path, at least one dummy conductor path is disposed corresponding in construction to said first mentioned conductor path;
• and
• a second conductor path spaced from said first mentioned conductor path by a relatively large distance, there being a plurality of dummy conductor paths which are arranged between said first mentioned and said second conductor paths.

A method of constructing an electrical circuit on a substrate comprising the steps of:

• arranging solderable material on the substrate along the paths of an array of electrical conductors to be formed on the substrate, the substrate being electrically insulating and nonadhesive to solder material,
• placing further solderable material on said substrate in an arrangement of paths for dummy electrical conductors in peripheral regions of said array of electrical conductors, and
• dipping said substrate into molten solder material for coating said solderable material with the solder material to construct said electrical conductors, said electrical conductors being formed of said solderable material, said dipping being accomplished by passing said substrate through said molten solder material with said array of electrical conductors being removed from said molten solder prior to removal of said dummy conductors to prevent buildup of excess solder material on said array of electrical conductors.