LCC co-planar lead frame semiconductor IC package
AssigneeMotorola, Inc.
InventorBernhard A. Ziegner
Life of this patent
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Abstract
An apparatus and method is disclosed for allowing faster and higher fidelity signals to be transmitted from a PC board to an IC by maintaining a constant impedance from the PC board to the IC. A leadless chip connector is used with a ground plane mounted co-planar to the conductor. As the conductor and ground planes extend toward the IC they decrease in width and the distance between the conductor and ground plane varies to maintain a constant impedance.
Claims7
A transmission device for coupling an IC device to a PC board comprising:
- a first controlled impedance means for controlling the impedance from said PC board, said first controlled impedance means being coupled to said PC board;
- a tapered conductor having a first end and a second end, said first end being wider than said second end, said first end of said tapered conductor being coupled to said first controlled impedance means and said second end being coupled to said IC device;
- and
- a tapered co-planar ground plane being juxtaposed to said tapered conductor, said tapered co-planar ground plane having a first end and a second end said first end being wider than said second end, said first end of said tapered co-planar ground plane being juxtaposed to said first end of said tapered conductor and said second end of said tapered co-planar ground plane being juxtaposed to said second end of said tapered conductor.
A method of transmitting a signal from a PC board to an IC device through an LCC co-planar transmission device comprising the steps of:
- transmitting said signal from said PC board to an impedance matching substrate, said impedance matching substrate defining an opening therethrough;
- transmitting said signal along a conductive wall of the opening of said impedance matching substrate;
- and
- transmitting said signal along a tapered conductor from said controlled impedance means to said IC device, said tapered conductor juxtaposed to a tapered co-planar ground plane forming a controlled impedance substantially through the length thereof.
A transmission device for coupling an IC device to a PC board comprising:
- a first conductor of predetermined impedance coupled to a conductor of said PC board;
- a first substrate having a first surface, a second surface, and an opening disposed therethrough;
- a second conductor disposed on a wall of the opening of said first substrate, said second conductor having a first end and second end, said first end being coupled to said first conductor, said second conductor also having a predetermined inductance and said second conductor reacting with said first conductor to maintain a controlled impedance with said PC board;
- a tapered conductor coupling said second end of said second conductor to said IC device, said tapered conductor being disposed on said first surface of said first substrate;
- and
- a coplanar ground plane being juxtaposed to said third conductor, said co-planar ground plane being disposed on said first surface of said first substrate and said co-planar ground plane reacting with said tapered conductor to maintain a controlled impedance from said second conductor to said IC device.
Dependencies are inferred from the claim text.