Apparatus for scribing semiconductor wafer with laser beam
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorBunzi Takeuchi
Life of this patent
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Abstract
An apparatus is adapted to scribe a semiconductor wafer with a laser beam in only one direction of an axis. The apparatus includes an XY table for placing the wafer thereon, a laser beam oscillator provided above the XY table, and an optical system for permitting the laser beam to be directed onto the wafer on the XY table. In order to scribe the wafer in only one direction, the apparatus further includes a light interrupting switch adapted to permit the laser beam to pass when the XY table is moved in only one direction in synchronism with an XY table driving motor and to permit the laser beam to be interrupted when the XY table is moved in the other directions.
Claims8
An apparatus for scribing a semiconductor wafer with a laser beam, comprising:
- an XY table for placing a semiconductor wafer thereon;
- a motor for driving the XY table in X and Y directions;
- a laser beam oscillator disposed above the XY table;
- an optical system for targeting the laser beam from the laser beam oscillator on the semiconductor wafer which is placed on the XY table;
- and
- light interrupting means operated in accordance with the direction of movement of the XY table for passing the laser beam from the laser beam oscillator only when the XY table is moved in a predetermined direction in synchronism with the motor and for interrupting the laser beam from the oscillator when the XY table is moved in other directions, said light interrupting means including a light interrupting switch positioned in the path of the laser beam.
Dependencies are inferred from the claim text.