Back to results
US 4,543,319 AGranted
Polystyrene-tetrathiafulvalene polymers as deep-ultraviolet mask material
AssigneeInternational Business Machines Corporation
InventorsVivian W. Chao, Frank B. Kaufman, Steven R. Kramer, Burn J. Lin
Life of this patent
Estimating the term…
Abstract
A method is provided for providing a polystyrene-tetrathiafulvalene (PSTTF)/deep-ultraviolet hydrid system which combines the advantages of E-beam or X-ray lithography systems with those of deep-UV conformable printing to produce low bias, high aspect ratio resist images over the topography of microelectronic devices.
Claims19
A method for producing a negative resist image which consists of:
- (a) coating a substrate with a deep-ultraviolet sensitive polymer;
- (b) coating said deep-ultraviolet sensitive polymer with an undyed halocarbon-doped electroactive polymer having the repeating unit:
- ##STR3## wherein the value of X is 0.ltoreq.X<1 and n is from about 50 to about 10,000;
- (c) pattern exposing said halocarbon-doped electroactive polymer with E-beam or X-ray radiation;
- (d) developing said exposed halocarbon-doped electroactive polymer with a preferential solvent to reveal portions of the underlying deep-ultraviolet sensitive polymer;
- (e) exposing said revealed portions of the underlying deep-ultraviolet sensitive polymer with deep-ultraviolet radiation;
- and
- (f) developing said exposed deep-ultraviolet sensitive polymer with a preferential solvent.
5 more elements
Dependencies are inferred from the claim text.