Method and system for reproducing relief structures onto a substrate
AssigneeDocdata N.V.
InventorJoseph M. E. Beaujean
Life of this patent
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AssigneeDocdata N.V.
InventorJoseph M. E. Beaujean
Estimating the term…
Method for reproducing relief structures onto a substrate, whereby between a die surface comprising holes or protuberances corresponding to the negative shape of the relief to be reproduced, and a substrate a hardenable liquid is deposited. After depositing the die surface and the substrate are at least locally forced together whereby the respective section of the die surface does not move in relation to the substrate in any other direction than perpendicular to the contact surface. During the following hardening of said liquid there is no mutual movement between the die surface and the substrate both of which remain forced together with a pressure which is smaller than the pressure during the initial pressing stage. The substrate and the die surface are separated after the liquid is hardened. There are significant differences in the chemical or physical parameters which have influence onto the hardening process between those liquid parts forming the higher relief parts and those liquid parts forming the lower relief parts.
Method for reproducing relief structures onto a substrate, whereby between a die surface comprising holes or protuberances corresponding to the negative shape of the relief to be reproduced, and a substrate a hardenable liquid is deposited, whereafter the die surface and the substrate are least locally forced together whereby the respective section of the die surface does not move in relation to the substrate in any other direction than perpendicular to the contact surface, whereafter the hardenable liquid hardens during which process there is no mutual movement between the die surface and the substrate both of which remain forced together with a pressure which is smaller than the pressure during the initial pressing stage, and the substrate and the die surface are separated after the liquid is hardened, characterized in that there are significant differences in the chemical or physical parameters which have influence onto the hardening process between those liquid parts forming the higher relief parts and those liquid parts forming the lower relief parts.
Method according to claim, 1 characterized in that the substrate and the die surface are forced together according to a contact line and are maintained thereafter in contact with each other, whereby the pressure at the contact line is significantly, respectively at least 10 times larger than the pressure during the contact maintaining stage.
Dependencies are inferred from the claim text.