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US 4,542,438 AGranted
Hybrid integrated circuit device
AssigneeKabushiki Kaisha Toshiba
InventorToshio Yamamoto
Life of this patent
Estimating the term…
Abstract
Circuit elements and lead connecting metal pieces are set on a conductor circuit formed on a ceramic substrate and are bonded to the conductor circuit by reflow soldering. A head of a lead is set on each of the metal pieces and connected thereto by setting electrodes in contact with the lead head and supplying welding current from the electrodes through the lead head and metal piece.
Claims5
A hybrid integrated circuit device comprising:
- a circuit substrate including an insulating substrate having two surfaces opposed to each other and a conductor circuit pattern having at least one connecting poad formed on one of the surfaces of said substrate;
- circuit elements soldered to said conductor circuit pattern of said circuit substrate;
- at least one metal piece plated with solder and soldered to said at least one connecting pad of said conductor circuit pattern of said circuit substrate, said metal piece having a free surface opposed to the surface oldered to said connecting pad;
- and
- at least one lead wire having a T-shaped head and being plated with said solder, said at least one lead wire being soldered to said metal piece and welded at said T-shaped head to the free surface of said metal piece which is opposed to the surface soldered to said connecting pad so as to project from said circuit substrate.
2 more elements
Dependencies are inferred from the claim text.