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US 4,542,260 AGranted
Encapsulated assemblies
AssigneeGEC Avionics Limited
InventorDavid W. Pearce
Life of this patent
Estimating the term…
Abstract
An encapsulated assembly of electric components (12) on a board (11) wherein the board and components are encapsulated in a mass of silicone rubber (17) which rubber mass is in turn encapsulated in a mass of rigid epoxy resin compound (21) which is partially supported by pillars (13) which are mounted on the board and extend outwardly to the surface of the mass of foamed silicone rubber, electrical connection to the components being provided by connector pins (15) extending through both encapsulations.
Claims6
An encapsulated assembly comprising electric components on a board;
- support pillars mounted on and projecting outwardly from at least one of the major surfaces of the board;
- connector pins for the components extending outwardly from the board;
- a mass of foamed silicone rubber encapsulating the board and components so that the outer ends of the support pillars are substantially flush with the surface of the mass and the ends of the connector pins extend outwardly beyond the surface of the mass;
- and a mass of substantially rigid epoxy resin compound encapsulating said foamed rubber mass from which resin compound mass the outer ends of the connector pins only project.
1 more element
Dependencies are inferred from the claim text.