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US 4,542,259 AGranted
High density packages
AssigneeOlin Corporation
InventorSheldon H. Butt
Life of this patent
Estimating the term…
Abstract
Several embodiments of high density packages which form an enclosure adapted to receive electronic devices are disclosed. Each package includes a metal lead frame having staggered leads which extend external to the package. A seal ring construction is provided so that hermetic seals are possible without subjecting the electronic devices to high temperatures. Various metals and sealing materials are advantageously used in the contruction of the devices.
Claims47
A high density package forming an enclosure for receiving an electronic device, comprising:
- a metal or metal alloy base member, said base member having a plurality of openings extending therethrough being disposed adjacent at least two opposing sides thereof;
- a metal or metal alloy lead frame having a first surface disposed adjacent said base member, said lead frame having first and second rows of leads extending from at least two opposing sides thereof, each of said first and second rows including a plurality of leads;
- a metal or metal alloy seal ring member disposed adjacent a second surface of said lead frame;
- said lead frame being disposed so that each of said plurality of leads in said first row extends through one of said plurality of openings in said base member external to said package and each of said plurality of leads in said second row extends between said base member and said seal ring member external to said package;
- a metal or metal alloy cover member disposed adjacent said seal ring member;
- and
- means for sealing said enclosure, the seal means disposed between said base member and said lead frame, between said lead frame and said seal ring member and between said seal ring member and said cover member.
4 more elements
The process of forming a high density package enclosing an electronic device, comprising the steps of:
- providing a metal or metal alloy base member, said base member having a plurality of openings extending therethrough and disposed adjacent at least two opposite sides thereof;
- providing a metal or metal lead frame having first and second rows of leads extending from at least two opposing sides thereof, each of said first and second rows including a plurality of leads;
- providing a metal or metal alloy seal ring member;
- providing a metal or metal alloy cover member;
- bending said plurality of leads of said first row so as to extend transversely to an axis through the plane of said lead frame member;
- sealing said lead frame to said seal ring member;
- disposing the sealed lead frame and seal ring member adjacent said base member so that each of said plurality of leads on said first row extends through one of said plurality of openings in said base member;
- sealing said lead frame and said base member;
- affixing the electronic device to said base member;
- and
- sealing said cover member to said seal ring member.
8 more elements
A high density package forming an enclosure for receiving electronic device, comprising:
- a metal or metal alloy base member, said base member having a plurality of openings extending therethrough and disposed adjacent at least two opposing sides thereof;
- said base member further having a plurality of slots extending from the edges of said least two opposite sides thereof;
- a metal or metal alloy lead frame having a first surface disposed adjacent said base member, said lead frame having first and second rows of leads extending from at least two opposing sides thereof, each of said first and second rows including a plurality of leads;
- a metal or metal alloy seal ring member disposed adjacent a second surface of said lead frame;
- said lead frame disposed so that each of said plurality of leads in said first row extends through one of said plurality of openings in said base member external to said package and each of said plurality of leads in said second row extending through one of said plurality of slots in said base member;
- a metal or metal alloy cover member disposed adjacent said seal ring member;
- and
- means for sealing said enclosure, the seal means disposed between said base member and said lead frame, said lead frame and said seal ring member and between said seal ring membr and said cover member.
5 more elements
The process of forming a high density package enclosing an electronic device, comprising the steps of:
- providing a metal or metal alloy base member, said base member having a plurality of openings extending therethrough and disposed adjacent at least two opposite sides thereof;
- said base member further having a plurality of slots extending from the edges of said at least two opposite sides thereof;
- providing a metal or metal lead frame having first and second rows of leads extending from at least two opposing sides thereof, each of said first and second rows including a plurality of leads;
- providing a metal or metal alloy seal ring member;
- providing a metal or metal alloy cover member;
- bending said plurality of leads in said first and second rows so as to extend transversely to an axis extending through the plane of said lead frame member;
- sealing said lead frame and said base member;
- disposing the sealed lead frame and seal ring member adjacent said base member with each of said plurality of leads on said fist row extending through one of said plurality of openings in said base member and each of said plurality of leads in said second row extending through one of said plurality of slots in said base member;
- sealing said lead frame to said seal ring member;
- affixing the electronic device to said base member;
- and
- sealing said cover member to said seal ring member.
9 more elements
A high density package forming an enclosure adapted to receive an electronic device, comprising:
- a metal or metal alloy base member;
- a metal or metal alloy lead frame having a first surface disposed adjacent said base member, said lead frame comprised of a plurality of leads of varying lengths, each of said leads being bent at one end transverse to a plane through said lead frame;
- a metal or metal alloy seal ring member disposed adjacent a second surface of said lead frame, said seal ring member having a plurality of openings extending therethrough, each adapted to receive one of the bent ends of said plurality of leads;
- metal or metal alloy cover member disposed adjacent said ring member;
- and
- means for sealing said enclosure, the seal means being disposed between said base member and said lead frame, between said lead frame and said ring member and between said seal ring member and said cover member.
3 more elements
The proces of forming a high density package receiving an electronic device, comprising the steps of:
- providing a metal or metal alloy base member;
- providing a metal or metal alloy lead frame having a plurality of leads of varying lengths, one end of each of said leads being bent transverse to the plane through said lead frame;
- providing a seal ring member having a plurality of openings extending therethrough;
- providing a metal or metal alloy cover member;
- positioning each of said bent leads through one of the openings on said seal ring member;
- sealing said lead frame to said seal ring member;
- sealing said lead frame to said base member;
- affixing the electronic device to said base member;
- and
- sealing said cover member to said seal ring member.
7 more elements
Dependencies are inferred from the claim text.