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AssigneeKollmorgen Technologies Corporation
InventorCharles L. Lassen
Estimating the term…
A process for making substrates for interconnecting components in which a filament is applied and affixed to a base in a pre-programmed pattern, the base surface and applied filaments are coated with a coating and the coating is hardened to form a substantially flat surface over the base and filaments. The coated base is then positioned on a table movable along "x" and "y" axes and the coated base is positioned under a high energy beam at pre-programmed points on the applied filament pattern and access openings are formed in the coating on the base at such points to expose the filament at each such point so that the exposed filament can be interfaced with the exposed surface of the coated base and articles for mounting and interconnecting components formed thereby.
A process for making substrates for mounting and interconnecting high density components, the steps comprising:
A process for making substrates for mounting and interconnecting high density networks, the steps comprising:
A process for providing high density networks, the steps comprising:
A process for making substrates on which to mount and interconnect networks having high density, the steps comprising:
Dependencies are inferred from the claim text.