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US 4,541,003 AGranted
Semiconductor device including an alpha-particle shield
AssigneeHitachi, Ltd.
InventorsKanji Otsuka, Kazumichi Mitsusada, Masao Sekibata, Shinji Ohnishi
Life of this patent
Estimating the term…
Abstract
The present invention relates to a semiconductor device having a semiconductor element which is sealed by a ceramic package, wherein a shielding member is provided near it from upper surface of the semiconductor element to shield the alpha-particles radiated from the package.
Claims24
A semiconductor device comprising:
- a support substrate having lower and upper surfaces;
- a semiconductor element fixed on a portion of said upper surface of the support substrate;
- a cap having lower and upper surfaces and connected at a portion of its lower surface to the peripheral portion of said upper surface of the support substrate so as to seal said semiconductor element;
- and
- a shielding member for shielding the semiconductor element from alpha-particles radiated from said cap, said shielding member being disposed on another portion of said lower surface of the cap so as to be provided opposite to said semiconductor element,
- wherein said another portion of said lower surface of the cap protrudes toward said semiconductor element.
3 more elements
A semiconductor device comprising:
- a support substrate having lower and upper surfaces;
- a semiconductor element fixed on a portion of said upper surface of the support substrate;
- and
- a cap of a shielding material for shielding the semiconductor element from alpha-particles, said cap being connected to the peripheral portion of said upper surface of the support substrate so as to seal said semiconductor element,
- wherein said cap has a projection portion projecting toward said semiconductor element.
2 more elements
A semiconductor device comprising:
- a support substrate having lower and upper surfaces;
- a semiconductor element fixed on a portion of said upper surface of the support substrate;
- a cap having lower and upper surfaces and connected at a portion of its lower surface to the peripheral surface of said upper surface of the support substrate so as to seal said semiconductor element;
- and
- a shielding member for shielding the semiconductor element from alpha-particles radiated from said cap, said shielding member being disposed on another portion of said lower surface of the cap so as to be provided opposite to said semiconductor element, wherein the portion of said shielding member located opposite to said semiconductor element protrudes from other portions of said shielding member toward said semiconductor.
2 more elements
A semiconductor device comprising:
- a support substrate having lower and upper surfaces;
- a semiconductor element fixed on a portion of said upper surface of the support substrate;
- a cap having lower and upper surfaces and connected at a portion of its lower surface to the peripheral portion of said upper surface of the support substrate so as to seal said semiconductor element;
- and
- a shielding member for shielding the semiconductor element from alpha-particles radiated from said cap, said shielding member being disposed on another portion of said lower surface of the cap so as to be provided opposite to said semiconductor element, wherein a surface portion of said shielding member protrudes from other surface portions of said shielding member so as to lie near a surface of said semiconductor element in which an active element is formed.
2 more elements
A semiconductor device comprising:
- a semiconductor element having lower and upper main surfaces, said upper main surface having an active element formed therein;
- a sealing body for sealing said semiconductor element being formed of a sealing substrate and a sealing cap arranged opposite to each other, said semiconductor element being connected to a portion of an inner surface of said sealing substrate at its lower main surface;
- and a shielding member for shielding said upper main surface of the semiconductor element from alpha-particles radiated from said sealing cap, said shielding member being disposed on an inner surface of said sealing cap and having a thickness thicker at a portion located opposite to said upper main surface of the semiconductor element than at other portions of said shielding member.
An alpha particle resistant semiconductor arrangement comprising:
- a first and a second semiconductor element, each semiconductor element having a circuit adjacent one surface thereof,
- said first and second semiconductor elements being mounted in a package with said surface adjacent said circuit of said first semiconductor element being in face to face relationship with said surface adjacent said circuit of said second semiconductor element,
- such that each semiconductor element shields the circuit of the other from direct impact of alpha particles from said package.
Dependencies are inferred from the claim text.