Polymers based on bicyclic amide acetals/polyepoxides/polyisocyanates

The process comprising reacting a mixture of a bicyclic amide acetal, an epoxy resin and a polyisocyanate at a temperature in the range of from about room temperature up to about 200.degree. C. and at a pressure in the range of from about atmospheric up to about 100 atmospheres, wherein there is employed from 1 to 50% by weight of the total reactants of the bicyclic amide acetal, from 5 to 50% by weight of the total reactants of an eposide resin and from 0.8:1 to 3:1 equivalents of the polyisocyanate per combined equivalents of the bicyclic amide acetal and epoxy resin and wherein the bicyclic amide acetal corresponds to the formula ##STR3## wherein R, R' and R"' each independently represents hydrogen or an alkyl, an aryl, alkaryl or an ether group having from 1 to 18 carbon atoms and R" represents an alkyl group having from 1 to 18 carbon atoms or an aralkyl group having from 7 to 20 carbon atoms.