Dielectric substrates comprising cordierite and method of forming the same
OwnerCarl L. Eggerding, Edward A. Giessinventors
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Abstract
A method for forming a substrate for electronic applications having a dielectric constant of less than 6 is disclosed. The method comprises admixing crystalline cordierite particles having a size of 0.1--10 microns with a binder and solvent, casting the same into a sheet, drying the cast sheet into a self-supporting green sheet and then heating the green sheet to burn out the binder and to sinter the particles together. A metallization pattern is deposited on the green sheet after the casting but before the heating, the metallization pattern being molybdenum or tungsten. The cordierite has a defined coefficient of thermal expansion. A dielectric substrate for mounting of integrated circuit devices thereon is also disclosed.
Claims11
A method for forming a substrate for electronic applications having a dielectric constant of less than 6 comprising;
- admixing crystalline cordierite particles having a size of 0.1-10 microns with a binder and solvent therefor, casting said mixture into a sheet, drying said cast sheet into a selfsupporting green sheet substrate and heating said green sheet substrate to burn out said binder and to sinter said particles together, thereby forming said dielectric substrate, said process further comprising the step of depositing a metallization pattern on said green sheet substrate after said casting but before said heating to sinter, said metallization pattern being of a member selected from the group consisting of molybdenum and tungsten, and wherein said crystalline cordierite has a coefficient of thermal expansion of about 15.times.10.sup.-7 .degree. C..sup.-1 measured from 20.degree. to 100.degree. C.
A dielectric substrate for mounting of integrated circuit devices thereon, which dielectric substrate has a dielectric constant less than 6, comprising:
- a substrate of sintered particles of crystalline cordierite, said particles prior to sintering having a size of 0.1-10 microns, and
- at least two space and interconnected levels of electrical conductor patterns embedded in said substrate, said metallization pattern being of a member selected from the group consisting of molybdenum and tungsten, and wherein said crystalline cordierite has a coefficient of thermal expansion of about 15.times.10.sup.-7 .degree. C..sup.-1 measured from 20.degree. to 100.degree. C.
Dependencies are inferred from the claim text.