Resin-molded semiconductor device and a process for manufacturing the same

A process for manufacturing semiconductor devices comprising:

• a step of horizontally holding a sub-assembly that consists of a semiconductor pellet brazed to a pair of axial leads, and of depositing an epoxy resin of a predetermined amount onto the semiconductor pellet while turning the sub-assembly with the axial leads as a center;
• a step of heating the epoxy resin at a temperature of 160.degree. to 180.degree. C. for a period of 2 to 10 minutes while turning the sub-assembly, so that surface portions of the epoxy resin are hardened;
• and
• a step of heating the epoxy resin at a temperature of 160.degree. to 200.degree. C. for a period of 3 to 25 hours while maintaining the sub-assembly stationary without turning it, so that the epoxy resin is completely hardened.