Method of encapsulating electronic components by extrusion of plastic material

A method of encapsulating bare electronic components present in the form of a continuous strip in which the said components are aligned in a first direction, the bare electronic components being intended to be provided with envelopes of a defined profile obtained by extrusion, in a direction parallel to the said first direction, of at least one plastic material by means of an extrusion head, characterized in that the method of encapsulation is carried out for components with rigid connection wires extending in a second direction substantially at right angles to the first direction in which the components are aligned, in that the bare electronic components (11) are continuously inserted and immobilized in the envelopes of said profile so that the encapsulation is limited to the components (11) excluding the rigid connection wires, and in that in a final operation common sections of plastic material (15) extruded from said extrusion head, in which the aligned components are inserted and immobilized and of the continous strip (12), are cut so that the bare electronic components (11) provided with their envelopes (13, 14) are mutually separated.