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US 4,540,462 AGranted
Substrate for semiconductor modules and method of manufacture
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsNobuyuki Mizunoya, Hajime Kohama, Yasuyuki Sugiura
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Abstract
A method for manufacturing a semiconductor substrate. A copper sheet is placed on a surface of a ceramic plate and bonded thereto. A circuit pattern is then formed on the copper sheet by an etching process.
Claims16
A method of manufacturing a substrate having a predetermined copper pattern for a semiconductor module comprising the steps of:
- providing a ceramic plate;
- providing a copper sheet;
- putting the copper sheet on a surface of the ceramic plate;
- bonding the copper sheet to the ceramic plate surface by heating them;
- forming the predetermined pattern on the copper sheet;
- and
- etching the copper sheet in accordance with the predetermined pattern to form the substrate.
4 more elements
A method of manufacturing a substrate having a predetermind copper pattern for a semiconductor module comprising the steps of:
- providing a ceramic plate;
- providing two copper sheets;
- putting the copper sheets on opposite surfaces of the ceramic plate;
- bonding the copper sheets to the ceramic plate by heating them;
- forming the predetermined pattern on at least one of the copper plates;
- and
- etching at least the copper plate having the pattern formed therein to form the substrate.
4 more elements
Dependencies are inferred from the claim text.