Intelligent electronic connection socket

An electronic connection socket for connection of an external electronic package, said socket comprising:

• a first circuit board (11) having a plurality of first connection holes (22), a first central aperture (20) and a plurality of connection fingers (21) selectively disposed between said first connection holes and the perimeter (23) of said first central aperture;
• a semiconductor electronic device (25) disposed in said first central aperture of said first circuit board having a plurality of bonding pads (27) connected to selected connection fingers at said perimeter of said first central aperture by bonding wires (28);
• a plurality of first interconnection means (4) aligned with said first connection holes for connection of said socket to external electronic devices;
• a plurality of second interconnection means (3) aligned with said first connection holes for connection of said socket to the connection pins of an external electronic package;
• a plurality of third interconnection means (56, 58) aligned with said first connection holes for selectively connecting said connection fingers, said first interconnection means and said second interconnection means;
• a second circuit board disposed in a plane parallel to the plane of said first circuit board having first and second surfaces, a plurality of second connection holes (33) aligned with said first connection holes, a second central aperture (31) aligned with said first central aperature, a plurality of plated through holes (39) connecting said first and second surfaces of said second circuit board, a plurality of first surface connection fingers (30) disposed on said first surface of second circuit board and connecting at least one of said second connection holes and one of said plated through holes, at least one of said first surface connection fingers having portions disposed near the periphery of said second central aperture and bonded to said bonding pads of said semiconductor integrated device and a plurality of second surface connection fingers (36, 37) disposed on said second surface and connecting at least one of said second connection holes and one of said plated through holes;
• an insulating layer (53) disposed between said first circuit board and said second circuit board;
• and
• a body (6) of nonconducting material surrounding and encapsulating said first circuit board, said second circuit board, said semiconductor electronic device and said first, second and third interconnection means.