Apparatus for soldering workpieces
AssigneeZevatron GmbH, Gesellschaft fur Fertigungseinrichtungen der Elektronik
InventorHeino Pachschwoll
Life of this patent
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Abstract
An apparatus for soldering workpieces (29) has a main solder bath (20) with main solder wave (15) and the workpiece (29) is brought into contact with the surface of the main solder wave. The surface can be modulated by means of at least one additional solder outlet or inlet nozzle (11), in order to solder even densely packed circuit boards without problem and with complete wetting of all solder locations (FIG. 1).
Claims31
Apparatus for soldering workpieces as the workpieces are conveyed past the apparatus along a conveying path in a conveying direction, the apparatus comprising:
- a main solder melt having a workpiece contacting surface;
- a first solder nozzle fluidly coupled to said main solder melt;
- means for varying the angular position of the first solder nozzle relative to the solder melt;
- and
- means for pumping solder through said first solder nozzle to create a generally semi-spherical solder surface in said workpiece contacting surface of said solder melt.
Apparatus for soldering workpieces as the workpieces are conveyed past the apparatus along a conveying path in a conveying direction, the apparatus comprising:
- a main solder melt;
- a main solder nozzle fluidly coupled to said main solder melt;
- first means for pumping solder through said main solder nozzle to create a main solder wave having a workpiece contacting surface;
- a plurality of auxiliary solder nozzles fluidly coupled to said main solder melt, said auxiliary solder nozzles having upper ends positioned below at least a portion of said workpiece contacting surface;
- and
- a second means for pumping solder through said auxiliary solder nozzles to create generally semi-spherical solder lobes in said workpiece contacting surface of said solder melt.
Apparatus for soldering workpieces as the workpieces are conveyed past the apparatus along a conveying path in a conveying direction, the apparatus comprising:
- a main solder melt having a workpiece contacting surface;
- a main solder nozzle, fluidly coupled to said main solder melt, through which solder is pumped to create a main solder wave;
- an auxiliary solder nozzle fluidly coupled to said main solder melt, the auxiliary solder nozzle being arranged within the main solder nozzle;
- and
- means for pumping solder through said auxiliary solder nozzle to create a generally semi-spherical solder surface in said workpiece contacting surface of said solder melt.
Apparatus for soldering workpieces as the workpieces are conveyed past the apparatus along a conveying path in a conveying direction, the apparatus comprising:
- a main solder melt having a workpiece contacting surface;
- a main solder nozzle, fluidly coupled to said main solder melt, through which solder is pumped to create a main solder wave;
- an auxiliary solder nozzle fluidly coupled to said main solder melt;
- means for pumping solder through said auxiliary solder nozzle to create a generally semi-spherical solder surface in said workpiece contacting surface of said solder melt;
- and
- said main and auxiliary nozzles being arranged side by side along said conveying direction with said main solder nozzle at a higher elevation than said auxiliary solder nozzle so said main solder wave flows over said auxiliary solder nozzle.
Apparatus for soldering workpieces as the workpieces are conveyed past the apparatus along a conveying path in a conveying direction, the apparatus comprising:
- a passive solder melt having a workpiece contacting surface;
- a plurality of auxiliary solder nozzles, fluidly coupled to said passive solder melt, arranged in a row spaced apart from one another, the row extending substantially at a right angle to the conveying direction;
- means for movably mounting the row of auxiliary solder nozzles for horizontal displacement transverse to the conveying direction;
- and
- means for pumping solder through said auxiliary solder nozzle to create a generally semi-spherical solder surface in said workpiece contacting surface of said solder melt.
Dependencies are inferred from the claim text.