Bundling apparatus
AssigneeTokyo Shibaura Denki Kabushiki Kaisha
InventorsToshiyuki Miyano, Hideo Ohmura
Life of this patent
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Abstract
In a bundling apparatus, a main clamping mechanism presses a stack of paper sheets in the direction of thickness of the stack and holds the stack. A band is wound by a winder around the stack of paper sheets held by the main clamping mechanism. The end portions of the band wound around the stack of paper sheets are bonded by a heat-bonding mechanism. Specified data is stamped on the band wound around the stack by a data-stamping mechanism which includes a stamp bearing the specified data and a drive mechanism for bringing the stamp into contact with the band while the end portions of the band are being bonded to each other.
Claims9
A bundling apparatus which comprises:
- first clamping means for pressing a stack of objects in the direction of thickness of the stack and holding the stack;
- band-winding means for winding a band around the stack of objects held by the first clamping means;
- bonding means for bonding end portions of the band to each other, said end portions being positioned on one side of said stack;
- and
- data-stamping means for stamping specified data on the band wound around the stack, said data-stamping means including (a) a stamp bearing the specified data, and (b) first drive means for bringing the stamp into contact with a portion of the band positioned on another side of said stack opposite to said one side while the end portions of the band are being bonded to each other by said bonding means.
Dependencies are inferred from the claim text.