Click disc switch assembly

The improvement in a click disc assembly comprising:

• a printed wiring board including an electrically insulative base member and a plurality of first and of second electroconductive paths on such member corresponding to the rows and columns, respectively, of an X-Y matrix of contact pads disposed such that the pads in each X row thereof are parts of a respective one of said first paths, an array of metal electroconductive strips overlying such member so that the centerline of each such strip registers with the contact pads in a respective one of the Y columns of such pads, each such strip having formed therein a plurality of click discs each adapted by depression to engage a corresponding contact pad in the Y column corresponding to that strip, an insulating layer interposed between said strips and base member and having apertures for passage therethrough of said click discs, and a sealing sheet covering said strips and having on its underside an adhesive layer, said improvement comprising the features that:
• said strips are fixed in their positioning in the X and Y directions of said matrix only by a bonding of such strips by said adhesive layer to the underside of said sealing sheet, and said assembly further comprises a plurality of third electroconductive paths each corresponding to a respective one of said Y columns, each of said third paths (a) being disposed on said insulating layer and, at least in part, beneath the strip registering with the Y column corresponding to that path, and (b) having a junction portion which passes through an aperture in said insulating layer to join with the second path corresponding to such Y column so as to electromechanically couple such third and second paths together, and each such third path (c) being thereby adapted upon at least depression of any of the click discs in the corresponding strip to electrically couple such disc to the second path corresponding to that strip.