Method for making a varistor package

A method of making an encapsulated varistor package comprising the steps:

• Step 1--pressing a varistor powder mixture to form a pressed body, said pressed body having a first and a second side;
• Step 2--heating the product from step 1 to a range of about 1400.degree. C. to about 1500.degree. C. at about 5.degree. C./min to about 18.degree. C./min;
• Step 3--maintaining the product of step 2 at about 1400.degree. C. to about 1500.degree. C. for about one to about 4 hours;
• Step 4--cooling the product of step 3 at less than 4.degree. C./min to room temperature;
• Step 5--acid etching the product from step 4;
• Step 6--coating the product from step 5 with a fritted-silver suspension on selected areas on said first and second sides;
• Step 7--heating the product from step 6 to a range of about 540.degree. C. to about 820.degree. C. at about 5.degree. C./min to about 10.degree. C./min;
• Step 8--maintaining the product of step 7 at about 540.degree. C. to about 820.degree. C. for up to 20 minutes;
• Step 9--cooling the product of step 8 at less than 4.degree. C./min to room temperature;
• Step 10--soldering electrical leads on said first side and on said second side of the product of step 9;
• and
• Step 11--encapsulating the product of step 10 with a resilient epoxy resin to form an encapsulated varistor package.