Room temperature curable polyorganosiloxane composition
AssigneeToshiba Silicone Co., Ltd.
InventorsTakafumi Imai, Fumihiko Kobayashi
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Abstract
The present invention provides a room temperature curable polyorganosiloxane composition comprising: (A) 100 parts by weight in total of: (1) a polydiorganosiloxane of the general formula: ##STR1## (2) a silane of the general formula: R.sub.b.sup.3 Si(OR.sup.4).sub.4-b (B) 0.01 to 10 parts by weight of a curing catalyst; (C) 0.5 to 10 parts by weight of a nitrogen-containing silicon compound in which the nitrogen atom is bonded with a silicon atom through one or more carbon atoms and said nitrogen atom is further bonded directly with said silicon atom or another silicon atom; and (D) 0.05 to 50 parts by weight of a polyoxyalkylene chain-containing compound.
Claims20
A room temperature curable polyorganosiloxane composition comprising:
- (A) 100 parts by weight in total of:
- (1) a polydiorganosiloxane of the general formula:
- R.sub.a.sup.1 (R.sup.2 O).sub.(3-a) SiO--R.sub.2 SiO--.sub.n Si(OR.sup.2).sub.(3-a) R.sub.a.sup.1
- wherein R and R.sup.1 are the same or different and represent a monovalent substituted or unsubstituted hydrocarbon group, R.sup.2 represents a monovalent group selected from the group consisting of alkyl groups having 1 to 4 carbon atoms and alkoxyalkyl groups having 1 to 6 carbon atoms in total, a represents a number of 0 or 1 and n represents a number for controlling the viscosity of (a) from 100 to 500,000 cP at 25.degree. C., and
- (2) a silane of the general formula:
- R.sub.b.sup.3 Si(OR.sup.4).sub.4-b
- wherein R.sup.3 represents a monovalent substituted or unsubstituted hydrocarbon group, R.sup.4 represents a monovalent group selected from the group consisting of alkyl groups having 1 to 4 carbon atoms and alkoxyalkyl groups having 1 to 6 carbon atoms in total and b represents a number of 0 or 1, or a partially hydrolyzed condensate thereof with the proviso that the amount of (A)(1) is 85 to 100 wt. % based on the total of (A)(1) and (A)(2);
- (B) 0.01 to 10 parts by weight of a curing catalyst;
- (C) 0.5 to 10 parts by weight of a nitrogen-containing silicon compound in which the nitrogen atom is bonded with a silicon atom through one or more carbon atoms and said nitrogen atom is further bonded directly with said silicon atom or another silicon atom;
- and
- (D) 0.05 to 50 parts by weight of a polyoxyalkylene chain-containing compound.
Dependencies are inferred from the claim text.