Resins containing a low viscosity organopolysiloxane liquid dielectric and a method of insulating a conductor therewith

A completely cured insulating composition disposed about at least one conductor, said cured insulating composition necessarily having minute voids therein and/or having minute voids at the composition-conductor interface, said cured composition being a completely cured admixture of ingredients, the admixture comprising:

• (A) a liquid, polymerizable organic resin system selected from the group consisting of epoxy, polyurethane and polyester resin systems;
• (B) a low viscosity, liquid, non-polymerizable organopolysiloxane dielectric filler having the structural formula:
• (R).sub.3 --Si[OSi(R).sub.2 ].sub.n OSi(R).sub.3,
• where n=0 to about 10, and each R group is selected from H, alkyl having from 1 to 6 carbons, and phenyl;
• and
• (C) solid, inorganic filler particles, where the admixture contains from about 2 wt.% to about 15 wt.% liquid, organopolysiloxane dielectric based on the total weight of (A), (B) and (C), and from about 20 wt.% to about 85 wt.% solid, inorganic filler particles based on the total weight of (A), (B) and (C), and the liquid organopolysiloxane dielectric is from about 60% to about 95% soluble in the liquid, organic resin system;
• where the completely cured insulating composition is an organic resin matrix containing liquid organopolysiloxane dielectric, where the liquid organopolysiloxane dielectric remains non-polymerized, having precipitated out of solution as a liquid, and flows or diffuses through the resin matrix to fill the voids within the insulating composition or at the insulating composition-conductor interface, and where the liquid organopolysiloxane dielectric in the completely cured insulating composition will flow or diffuse to fill voids caused by thermal cycling or voltage stress which may occur after complete curing of the composition.