Technique for removing impurities from a copper melt
AssigneeOlin Corporation
InventorsDerek E. Tyler, Harvey P. Cheskis, Paul D. Tungatt
Life of this patent
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Abstract
A copper or copper alloy material having a reduced number of defects is formed by removing impurities from the material while in a molten state with a member having exposed silicon carbide particles. The member may be a bed filter formed from bed media having exposed silicon carbide particles, a porous body formed from a slurry containing silicon carbide, a porous body having at least one melt contacting surface coated with a silicon carbide material, and/or a lining having at least one melt contacting surface coated with a silicon carbide material.
Claims16
A process for forming a structure for removing impurities from a molten copper or copper base alloy, said process comprising:
- providing a material in a solid state consisting essentially of from about 5% to about 99% silicon carbide and the balance being selected from at least one of a filler material and a bonding material;
- and
- treating said material to expose silicon carbide particles at the outer periphery of said material to permit removal of said impurities by contact between said exposed silicon carbide particles and said molten copper or copper base alloy, said treating step maintaining said particles in an unoxidized condition.
A process for removing impurities from a molten copper or copper base alloy, said process comprising:
- providing a member formed from a material containing from about 5% to about 99% silicon carbide and at least one material selected from the group consisting of a filler material and a bonding material and having exposed silicon carbide particles;
- and
- placing said molten copper or copper base alloy in contact with said exposed particles so that said particles capture and remove at least some of said impurities in said molten copper or copper base alloy.
Dependencies are inferred from the claim text.