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US 4,536,638 AGranted
Chip assembly
OwnerWitold Krynickiinventor
Life of this patent
Estimating the term…
Abstract
A chip substrate providing registration features for chip components on the opposite to the circuit side with interconnecting through holes and method and means for simultanuously trimming these registration features for dimentional and location accuracy, drilling the interconnecting through holes for perfect registration with the registration features, and photoetching the high density portion of the circuit in and around the chip area.
Claims9
An integrated circuit chip carrier assembly comprising:
- a molded chip carrier substrate including a cavity portion molded-in chip registration elements in the cavity portion molded on said substrate and on one first side of said cavity portion;
- at least one chip comprising terminal pads and positioned within said registration elements with the side containing terminal pads facing said substrate;
- said molded substrate containing interconnecting through-holes corresponding to said terminal pads on said chip;
- a printed circuit on the second opposite side of said molded chip carrier substrate and printed through said through-holes and in electrical contact with said terminal pads on said chip.
1 more element
Dependencies are inferred from the claim text.