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US 4,536,524 AGranted
Microencapsulated epoxy adhesive system
AssigneeCapsulated Systems, Inc.
InventorsRonald L. Hart, Dale E. Work, Colin E. Davis
Life of this patent
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Abstract
A microencapsulated epoxy adhesive system is disclosed comprising in admixture epoxy resin capsules and encapsulated Ancamine TL (Pacific Anchor Chemical Co.) as the curing agent. When applied, for example to a zinc plated bolt and the bolt is tightened, the capsules break and the resin cures and provides good breakaway torques.
Claims1
An aqueous based epoxy adhesive system, comprising:
- a coacervate of polyvinyl alcohol;
- a solution of methylene dianiline;
- and microcapsules containing an epoxy resin;
- said polyvinyl alcohol coacervate comprising a continuous phase in which said methylene dianiline solution and said epoxy microcapsules are dispersed.
1 more element
Dependencies are inferred from the claim text.