Method of forming resist pattern
AssigneeDainippon Ink and Chemicals, Inc.
InventorsToshihiko Yasui, Tetsuo Matsumoto, Akihiko Akaike
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Abstract
A method of forming a resist pattern, which comprises printing a predetermined pattern on a substrate by a lithographic technique using a resist ink curable by irradiation of an active energy ray and/or heating, said ink containing (1) a metal chelate resin obtained by reacting (a) at least one resin selected from the group consisting of alkyd resins, modified alkyd resins, fatty acid-modified epoxy resins, urethanized oils and maleinized oils and (b) a metal compound capable of forming a coordination bond using the resin (a) as a ligand and (2) a polymerizable compound containing at least two ethylenically unsaturated bonds per molecule; and curing the printed pattern by irradiating an active energy ray and/or by heating.
Claims26
A method of forming a resist pattern, which comprises printing a predetermined pattern on a substrate by a lithographic technique using a resist ink curable by irradiation of an active energy ray and/or heating, said ink consisting essentially of (1) 100 parts by weight of a metal chelate resin obtained by reacting (a) 100 parts by weight of at least one resin having an acid value of 5 to 300 selected from the group consisting of alkyd resins, modified alkyd resins, fatty acid-modified epoxy resins, urethanized oils and maleinized oils and (b) 0.1 to 10 parts by weight of at least one metal compound selected from the group consisting of long chain fatty acid metal salts, metal alcoholates and intramolecular metal complex compounds and (2) 3 to 300 parts by weight of a polymerizable compound containing at least two ethylenically unsaturated bonds per molecule;
- and curing the printed pattern by irradiating with an acitve energy ray and/or by heating.
Dependencies are inferred from the claim text.