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US 4,536,055 AGranted
Stamped and formed stacking device for circuit boards and a method for making
AssigneeAMP Incorporated
InventorsSteven J. Kandybowski, Matthew M. Sucheski
Life of this patent
Estimating the term…
Abstract
The invention disclosed relates to a device for stacking, securing and spacing printed circuit boards, one on top of another. More particularly, the device is stamped and formed from coplanar stock and includes a reverse bend upper end which provides a receptacle for receiving the lower end of a device mounted in an overlying board or a lead from an electronic device, a lower end and an intermediate section for retaining the device in the board or in dielectric body.
Claims4
A method of making a device for stacking circuit boards, comprising the steps of:
- a. providing an elongated strip of material and cutting out an opening adjacent a first end, defining thereby a pair of side members;
- b. stamping out a leg at a second end with said leg being of less width than the width of the opening;
- c. cutting a pair of longitudinal, parallel slits in the elongated strip intermediate the two ends to define three side by side parallel segments;
- d. curving the first end around to near the slits so that the side members and opening define a receptacle for receiving a leg or the like therein;
- and
- e. forming a compliant member by bending the side by side segments outwardly with alternate segments being bent in opposite directions.
3 more elements
Dependencies are inferred from the claim text.