Microwave circuit device package

Abstract

A microwave circuit device package including a conductive housing and selectively interchangeable transmission line sections each one thereof being disposable in such housing and means for tuning and matching the impedance of the disposed transmission line section to the impedance of a device connected thereto over a relatively wide frequency band of applied signals. Such tuning means includes a conductive member of predetermined dimensions slidably mounted in proximity to a selected conductor portion of one of such transmission line sections. Such transmission line sections include a straight continuous in-line configuration for high frequencies or serpentine strip conductor configurations for low and intermediate frequencies, each one of such serpentine strip conductor configurations defining a different acute angle relative to the conductive member. The microwave circuit housing is used to test, calibrate, evaluate or characterize the properties of the connected device over the wide frequency bandwidths.

Dependencies are inferred from the claim text.