Handling system for IC device
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorOsamu Takeshita
Life of this patent
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Abstract
There is provided a handling system for IC devices having a guide stage comprising a bank portion in which both sides of a IC device to be tested are held at a position other than a portion where terminals of the IC device project and a vacuum suction pore which suctorially sticks to the underside of the IC device at the midpoint of the bank portion. There is also provided a handling system for IC devices wherein multiple bank portions are provided on the stage, one half of which is used for carrying IC devices and the remaining half of which is used for discharging IC devices.
Claims13
A system for handling IC packages, comprising:
- a substantially flat and horizontally disposed stage platform having means for holding at least one IC package on said state platform;
- means for reciprocatingly moving said stage platform vertically between an upper position and a lower position;
- means for loading IC packages onto said stage platform into said IC holding means when said stage platform is at said lower position;
- testing means for testing at least one IC package on said stage platform when the stage platform is in the upper position;
- drive means for rotating said stage platform about its center;
- means for unloading at least one IC package off said stage platform after the stage platform is rotated and after the IC package has been tested;
- and
- control means for sequentially controlling the means for loading and the means for unloading the IC package, and the means for reciprocatingly moving and means for rotating the stage platform.
Dependencies are inferred from the claim text.