Compliant pin for solderless termination to a printed wiring board

A low insertion force electrical interconnection resilient pin adapted for use with plated through-holes of varying size in a printed wiring board to provide good electrical connection between the leads of externally mounted components or wires and the printed wiring board holes comprising:

• a pin having an enlarged diameter proximal end and a reduced diameter distal end, said enlarged diameter proximal end including a tapered nose having an annular groove therein, said distal end having a shaft and means at the end of said shaft for making electrical contact to said leads or wire;
• a portion of said shaft, contact portion and said nose having a slot therethrough running from one side of said pin to the other for a length which includes said annular groove for dividing said shaft portion, said annular groove and said nose into two spaced apart portions, said slot thereby providing two spaced apart spring members, the spring moment applied to said spring members being sufficient to provide metal flow into said annular groove upon insertion of said resilient pin into a plated printed wiring board through-hole.