Hybrid circuit device
AssigneeToko, Inc.
InventorsKunihisa Endoh, Yasumitsu Hayakawa
Life of this patent
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Abstract
A hybrid circuit device comprising a flat package incorporating an integrated circuit therein, and a delay line constituted by a plurality of coils and capacitors. The base plate having the delay line mounted on one main surface thereof is placed, at the other main surface thereof, on the flat package. Upwardly bent terminals and non-bent terminals are led out of the flat package. The upwardly bent terminals connect the integrated circuit and delay line to each other at side portions of the base plate. Furthermore, separate terminals are provided in two rows holding the flat package therebetween and connected to the non-bent terminals of the flat package. The device is encapsulated, with the free end portion of each of the separate terminals being exposed.
Claims4
A hybrid circuit device comprising:
- a flat package incorporating an integrated circuit therein;
- a delay line circuit comprising a plurality of coils and a plurality of capacitors;
- a base plate supporting said delay line circuit, said base plate being disposed on said flat package;
- upwardly bent terminals led out of said flat package and connecting said delay line circuit and said integrated circuit to each other at side portions of said base plate;
- non-bent terminals led out of said flat package;
- separate terminals connected to said non-bent terminals respectively, said separate terminals being downwardly bent in such a manner as to be led out in two rows, in the form of dual line package, holding said flat package therebetween;
- and
- encapsulation surrounding said base plate and said package, with the free end portion of each of said separate terminals being exposed through said encapsulation.
Dependencies are inferred from the claim text.