Epoxy resin curing agent, process and composition
AssigneeMinnesota Mining and Manufacturing Company
InventorJanis Robins
Life of this patent
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Abstract
An epoxy resin latently curable composition including a novel curing agent comprising the liquid salt of a substituted pentafluoroantimonic acid and an aromatic amine selected from the group consisting of aniline and a hindered amine has a desirably long pot life yet cures rapidly with heating to a cured composition.
Claims21
A curing agent especially suited for curing thermally curable resin compositions curable therewith, said curing agent comprising
- (1) a substituted pentafluoroantimonic acid having the general formula H.sup.+ SbF.sub.5 X.sup.- wherein X is halogen, a hydroxy, or an OR group wherein OR is the residue of an aliphatic or aromatic alcohol;
- and
- (2) an aromatic amine selected from the group consisting of aniline;
- and hindered amine
- the mole ratio of said substituted pentafluoroantimonic acid to aromatic amine being in the range of 1:1.05 to 1:4.
A latent thermally curable composition, curable upon mixing and heating, comprising:
- Part A-epoxy resin composition having a 1,2-epoxy equivalency greater than one;
- and
- Part B-a curing agent in an amount sufficient to cure said composition on heating comprising
- (1) substituted pentafluoroantimonic acid having the general formula H.sup.+ SbF.sub.5 X.sup.- wherein X is halogen, a hydroxy, or an OR group wherein OR is the residue of an aliphatic or aromatic alcohol;
- and
- (2) an aromatic amine selected from the group consisting of aniline;
- and hindered amine
- the mole ratio of said substituted pentafluoroantimonic acid to aromatic amine being in the range of 1:05 to 1:4.
A process for curing thermally curable epoxy resin composition comprising:
- (a) mixing to provide a substantially uniform mixture:
- Part A-epoxy resin composition having a 1,2-epoxy equivalency greater than one;
- and
- Part B-a curing agent in an amount sufficient to cure said composition on heating, said curing agent comprising;
- (1) substituted pentafluoroantimonic acid having the general formula H.sup.+ SbF.sub.5 X.sup.- wherein X is halogen, a hydroxy, or an OR group wherein OR is the residue of an aliphatic or aromatic alcohol;
- and
- (2) an aromatic amine selected from the group consisting of aniline;
- and hindered amine
- the mole ratio of said substituted pentafluoroantimonic acid to aromatic amine being in the range of 1:1.05 to 1:4;
- and
- (b) heating said mixture for a time and at a temperature sufficient to cure said composition.
A cured composition comprising cured epoxy resin and residual curing agent derived from substituted pentafluoroantimonic acid and an aromatic amine selected from the group consisting of aniline and hindered amine.
A latent thermally curable composition, curable upon heating, comprising:
- (a) epoxy resin composition having a 1,2-epoxy equivalency greater than one;
- and
- (b) a curing agent in an amount sufficient to cure said composition on heating comprising
- (1) substituted pentafluoroantimonic acid having the general formula H.sup.+ SbF.sub.5 X.sup.- wherein X is halogen, a hydroxy, or an OR group wherein OR is the residue of an aliphatic or aromatic alcohol;
- and
- (2) an aromatic amine selected from the group consisting of aniline;
- and hindered amine
- the mole ratio of said substituted pentafluoroantimonic acid to aromatic amine being in the range of 1:1.05 to 1:4.
Dependencies are inferred from the claim text.