Silver plating procedure
AssigneeAT&T Bell Laboratories
InventorJoseph A. Abys
Life of this patent
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Abstract
A silver electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent silver films. The electroplating bath comprises silver complexed with an aliphatic polyamine compound with 3 to 20 carbon atoms. Particularly useful are such polyamines as diaminopropane (particularly 1,3-diaminopropane), diethylenetriamine, 1,4-diaminobutane, 1,6-diaminohexane, etc. The procedure is also useful for electroplating a variety of silver alloys. In addition, the bath is highly stable, does not adversely affect the base material being plated and does not contain hazardous materials which require special disposal procedures.
Claims13
A process for electroplating a metallic substance on a surface, said metallic substance consisting of at least 90 mole percent silver, comprising the step of passing current through a cathode, electroplating bath and anode with a cathode potential great enough to electroplate silver, said electrochemical bath having a conductivity greater than 10.sup.-3 mho-cm and a pH greater than 7 characterized in that the electroplating bath is an aqueous solution comprising
- a. a source of silver, said source of silver consisting essentially of silver-aliphatic polyamine complex in which the aliphatic polyamine has from 3 to 20 carbon atoms and substituents are selected from the group consisting of hydrogen, hydroxide, chloride and bromide and said aqueous solution has a silver concentration between 0.01 molar and saturation and an aliphatic polyamine concentration of from 2 to 12 times the mole concentration of silver and
- b. a buffer, said buffer consisting essentially of the hydrogen phosphate/phosphate system with buffer concentration between 0.1 and 2 molar and with the ratio of hydrogen phosphate to phosphate ion from 5/1 to 1/5.
Dependencies are inferred from the claim text.