Flow sensor
AssigneeHoneywell Inc.
InventorPhilip J. Bohrer
Life of this patent
Estimating the term…
Abstract
A flow sensor comprising a pair of thin film heat sensors and a thin film heater is disclosed. A base supports the sensors and heater out of contact with the base with the sensors disposed on opposite sides of the heater. The heater is operated at a constant temperature above ambient temperature under both flow and no-flow conditions. Also disclosed is a flow sensor wherein a portion of the depression is devoid of a side wall.
Claims68
A flow sensor, comprising:
- a thin film heater suspended in air;
- a pair of thin film heat sensors suspended in air and disposed on opposite sides of the heater;
- and
- means for operating the thin film heater at a constant temperature above ambient temperature under both flow and no-flow conditions.
A flow sensor, comprising:
- a thin film heater;
- a pair of thin film heat sensors;
- a semiconductor body supporting the heater and sensors with at least a major portion of the heater and sensors out of contact with the body and with the sensors disposed on opposite sides of the heater;
- and
- means for operating the thin film heater at a constant temperature above ambient under both flow and no-flow conditions.
A flow sensor, comprising:
- a thin film heater;
- a pair of thin film sensors;
- a semiconductor body with a depression therein;
- means connecting the heater and the sensors to the body and bridging the depression so that at least a major portion of the heater and the sensors are out of contact with the body and with the sensors disposed on opposite sides of the heater;
- and
- means for operating the thin film heater at a constant temperature above ambient temperature under both flow and no-flow conditions.
A flow sensor comprising:
- a thin film heater encapsulated in thin film dielectric;
- a pair of thin film sensors encapsulated in thin film dielectric, the sensors being disposed on opposite sides of the heater;
- a semiconductor body with a depression therein;
- the encapsulated heater and sensors forming at least one thin film member bridged across the depression so that at least a major portion of the heater and the sensors are out of contact with the semiconductor body;
- and
- means for operating the thin film heater at a constant temperature above ambient temperature under both flow and no-flow conditions.
A flow sensor comprising:
- a semiconductor body having a depression formed into a first surface of the body;
- a thin film heater encapsulated in thin film dielectric;
- a pair of thin film sensors encapsulated in thin film dielectric, the thin film sensors being disposed on opposite sides of the heater;
- the encapsulated heater and sensors forming at least one thin film member, the at least one thin film member being attached to the first surface at least at one location in order to suspend at least a major portion of the heater and sensors over the depression;
- and
- means for operating the thin film heater at a constant temperature above ambient temperatures under both flow and no-flow conditions.
A flow sensor, comprising:
- a thin film heater;
- a pair of thin film sensors;
- a semiconductor body with a depression therein;
- and
- means connecting the heater and the sensors to the body and bridging the depression so that a least a major portion of the heater and the sensors are out of contact with the body and with the sensors disposed on opposite sides of the heater, a portion of the depression being devoid of a side wall.
A flow sensor comprising:
- a thin film heater encapsulated in thin film dielectric;
- a pair of thin film sensors encapsulated in thin film dielectric, the sensors being disposed on opposite sides of the heater;
- a semiconductor body with a depression therein;
- and
- the encapsulated heater and sensors forming at least one thin film member bridged across the depression so that at least a major portion of the heater and the sensors are out of contact with the semiconductor body;
- a portion of the depression being devoid of a side wall.
A flow sensor comprising:
- a semiconductor body having a depression formed into a first surface of the body;
- a thin film heater encapsulated in thin film dielectric;
- and
- a pair of thin film sensors encapsulated in thin film dielectric, the thin film sensors being disposed on opposite sides of the heater;
- the encapsulated heater and sensors forming at least one thin film member, the at least one thin film member being attached to the first surface at least at one location in order to suspend at least a major portion of the heater and sensors over the depression, a portion of the depression being devoid of a side wall.
Dependencies are inferred from the claim text.